Some time ago Samsung showed a high-profile memory stick with a capacity of up to 256GB, saying that this memory is about to land on the server platform. Let me talk about the specifications of this memory:
This 256GB memory is also RDIMM specification, supports ECC error correction, and is equipped with up to 36 memory chips, each with a capacity of 8GB (64Gb). The internal integration is the new single particle with 16Gb (2GB) capacity, and the four passes. TSV TSV technology is integrated in one chip.
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Samsung is about to launch 256G memory
After all, the memory performance specifications of the server platform are not too bad, so what is the use of consumer-level players for it? Let's take the AMD EPYC Snapdragon platform as an example. Now we support the largest single 128GB LRDIMM memory. The single/dual system has a maximum memory capacity of 2/4TB. If it can support a single 256GB by updating the microcode, or on the next generation 7nm platform, single/ Dual system memory can reach 4/8TB.
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Intel Xeon Xeon will also release the next generation of Cascade Lake at the end of the year, on which consumers may see 3.84TB of memory, which is the number of 12 slots, and if replaced by a single 256GB, the two-way system will be available. 6TB.
As for the price, although it is not announced, it will not be too cheap. The Yingruida 128GB LRDIMM is now worth 3,300 US dollars, not to mention the 256G capacity of Samsung memory. It should be able to double the price without accident.
